Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1994-12-20
1997-02-25
Ramsey, Kenneth J.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228 9, 228 19, B23K 1018
Patent
active
056052774
ABSTRACT:
A cost efficient, highly reliable method to remove electronic devices and components from substrates eliminates separate tooling for every substrate and device or component size. The apparatus which implements the method allows for multiple device or component removal simultaneously, or in a single sequential operation, in a nondestructive action in a very low cost environment. A box oven and vacuum system and is used with different device or component and substrate sizes providing a simple, low cost, molten device removal procedure, eliminating the need for thermal monitor build and associated profiling for each product. The apparatus works independently of chip type or size, utilizing universal fixturing, and can be set up to pull multiple devices and/or components in a single run.
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Kostenko and O'Rourke, "IR/N.sub.2 Heated Isothermal and Movable Light Mass Oven", dtd Dec. 1984, IBM Technical Disclosure Bulletin, V27, N7A, pp. 3970 thru 3972.
Jackson Raymond A.
Lidestri Kathleen A.
Linnell David C.
Master Raj N.
Sablinski William E.
International Business Machines - Corporation
Murray Susan M.
Ramsey Kenneth J.
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