Hot edge ring with sloped upper surface

Details Hot edge ring with sloped upper surface Hot edge ring with sloped upper surface

2010-11-02

2011-12-27

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Miscellaneous

C438S689000, C438S758000, C118S728000, C118S7230AN, C156S345510

Reexamination Certificate

active

08084375

ABSTRACT:
A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.

REFERENCES:
patent: 5411624 (1995-05-01), Hirano et al.
patent: 6073577 (2000-06-01), Lilleland et al.
patent: 7244336 (2007-07-01), Fischer et al.
patent: 7252738 (2007-08-01), Tong et al.
patent: 7658816 (2010-02-01), Koshiishi et al.
patent: 7758764 (2010-07-01), Dhindsa et al.
patent: 2004/0074605 (2004-04-01), Nezu et al.
patent: 2005/0005859 (2005-01-01), Koshiishi et al.
patent: 2005/0133164 (2005-06-01), Fischer et al.
patent: 2005/0133760 (2005-06-01), Farrand et al.
patent: 2007/0187038 (2007-08-01), Ren et al.
patent: 2007/0283884 (2007-12-01), Tiller et al.
patent: 2008/0090417 (2008-04-01), de la Llera et al.
patent: 2008/0241420 (2008-10-01), Dhindsa et al.
patent: 2008/0308228 (2008-12-01), Stevenson et al.
patent: 2009/0200269 (2009-08-01), Kadkhodayan et al.

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