Hot carrier injection programmable structure including...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S330000, C257S242000, C257SE29260, C257SE29257, C438S259000, C438S270000, C438S271000, C438S589000

Reexamination Certificate

active

07459744

ABSTRACT:
A programmable storage device includes a first diffusion region underlying a portion of a first trench defined in a semiconductor substrate and a second diffusion region occupying an upper portion of the substrate adjacent to the first trench. The device includes a charge storage stack lining sidewalls and a portion of a floor of the first trench. The charge storage stack includes a layer of discontinuous storage elements (DSEs). Electrically conductive spacers formed on opposing sidewalls of the first trench adjacent to respective charge storage stacks serve as control gates for the device. The DSEs may be silicon, polysilicon, metal, silicon nitride, or metal nitride nanocrystals or nanoclusters. The storage stack includes a top dielectric of CVD silicon oxide overlying the nanocrystals overlying a bottom dielectric of thermally formed silicon dioxide. The device includes first and second injection regions in the layer of DSEs proximal to the first and second diffusion regions.

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