Hollow sealing structure and manufacturing method for hollow...

Details Hollow sealing structure and manufacturing method for hollow... Hollow sealing structure and manufacturing method for hollow...

2011-04-26

2011-04-26

Warren, Matthew E (Department: 2815)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S737000, C438S745000, C257SE29167, C257SE29324

Reexamination Certificate

active

07932116

ABSTRACT:
A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substrate, a process for forming a second sacrificial layer on the functional element portion so as to be connected to a part of the first sacrificial layer, a process for forming a covering portion over respective surfaces of the first and second sacrificial layers, a process for circulating a fluid for sacrificial layer removal through an opening in the covering portion in contact with the first sacrificial layer, thereby removing the first and second sacrificial layers, and a process for closing the opening.

REFERENCES:
patent: 7138694 (2006-11-01), Nunan et al.
patent: 7144750 (2006-12-01), Ouellet et al.
patent: 2007/0054433 (2007-03-01), DeNatale et al.
patent: 2005-207959 (2005-08-01), None

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