Hollow package manufacturing method

Details Hollow package manufacturing method Hollow package manufacturing method

1997-03-26

1999-05-18

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438616, 257704, 257710, 257924, H01L21/44;21/48;21/50

Patent

active

059045019

ABSTRACT:
A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

REFERENCES:
patent: 5596171 (1997-01-01), Harris et al.
patent: 5635672 (1997-06-01), Kawaura

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