Holes and spaces shrinkage

Details Holes and spaces shrinkage Holes and spaces shrinkage

1990-11-09

1992-03-17

Mc Camish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Post imaging radiant energy exposure

430330, 430331, 430394, G03F 740

Patent

active

050968025

ABSTRACT:
A controllable feature shrinkage technique permits shrinkage of feature sizes beyond the capability of current lithographic tools by using high temperature flow to shrink the conventionally formed resist image of the feature and then deep UV exposure to stabilize the resist profile at the desired reduced size. A preliminary partial stabilization using hard bake and low intensity deep UV exposure reduces the rate of resist flow at temperature, permitting better control and repeatability of the amount of shrinkage. Feature sizes in the range of about 0.15 .mu.m may be achieved.

REFERENCES:
patent: 4548688 (1985-10-01), Matthews
Badami et al., "Photoresist Reflow Reversal", IBM Technical Disclosure, vol. 26, No. 10A, Mar. 1984, pp. 5094-5095.

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