Coating apparatus – Gas or vapor deposition – Having means to expose a portion of a substrate to coating...
Patent
1994-09-02
1995-10-10
Bueker, Richard
Coating apparatus
Gas or vapor deposition
Having means to expose a portion of a substrate to coating...
118728, 118503, 20429811, 20429815, C23C 1400
Patent
active
054567564
ABSTRACT:
A holding apparatus, a metal deposition system and a wafer processing method which preserve topographical marks, including those used as alignment targets, on a semiconductor wafer by preventing metal from depositing on such marks during metal deposition. The invention eliminates the need to use window mask and etch techniques to provide replication of topographical marks on a newly formed metal layer when a CMP planarization technique is used prior to metal deposition. As a result, cost, cycle time and yield loss due to the additional window mask and etch steps can be eliminated. The holding apparatus includes a wafer retainer for retaining a wafer which has at least one topographical mark and a clamp ring with at least one tab. The wafer is pressed against the clamp ring by the retainer for securing the wafer in the retainer. Each tab is positioned directly above a corresponding one of the topographical mark and has an area big enough to cover such mark for avoiding metal being deposited on such mark during metal deposition of the wafer. The metal deposition system comprises a depositing system for depositing a layer of a selected metal onto the wafer. The metal deposition system also includes a holding apparatus constructed in accordance with the present invention for holding the wafer during metal deposition. The processing method comprises forming an optically transparent oxide layer over the wafer which includes at least one topographical mark and providing a metallized layer over the wafer except over such mark.
REFERENCES:
patent: 4470975 (1984-09-01), Poteat
patent: 4592308 (1986-06-01), Shih
patent: 4599970 (1986-07-01), Peterson
patent: 4944836 (1990-07-01), Beyer et al.
Chan Darin A.
Ramaswami Seshadri
Advanced Micro Devices , Inc.
Bueker Richard
Kwong Raymond Kam-On
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