Holding apparatus, a metal deposition system, and a wafer proces

Details Holding apparatus, a metal deposition system, and a wafer proces Holding apparatus, a metal deposition system, and a wafer proces

1995-06-07

1997-03-25

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

437245, 1566341, H01L 2128

Patent

active

056144466

ABSTRACT:
A holding apparatus, a metal deposition system and a wafer processing method which preserve topographical marks, including those used as alignment targets, on a semiconductor wafer by preventing metal from depositing on such marks during metal deposition. The invention eliminates the need to use window mask and etch techniques to provide replication of topographical marks on a newly formed metal layer when a CMP planarization technique is used prior to metal deposition. As a result, cost, cycle time and yield loss due to the additional window mask and etch steps can be eliminated. The holding apparatus includes a wafer retainer for retaining a wafer which has at least one topographical mark and a clamp ring with at least one tab. The wafer is pressed against the clamp ring by the retainer for securing the wafer in the retainer. Each tab is positioned directly above a corresponding one of the topographical mark and has an area big enough to cover such mark for avoiding metal being deposited on such mark during metal deposition of the wafer. The metal deposition system comprises a depositing system for depositing a layer of a selected metal onto the wafer. The metal deposition system also includes a holding apparatus constructed in accordance with the present invention for holding the wafer during metal deposition. The processing method comprises forming an optically transparent oxide layer over the wafer which includes at least one topographical mark and providing a metallized layer over the wafer except over such mark.

REFERENCES:
patent: 4470875 (1984-09-01), Poteat
patent: 4944836 (1990-07-01), Beyer et al.

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