Metal fusion bonding – Process – Diffusion type
Patent
1999-02-02
2000-12-26
Ryan, Patrick
Metal fusion bonding
Process
Diffusion type
228194, B23K 2000, B23K 2800
Patent
active
061645249
ABSTRACT:
A HIP-bonded body of a beryllium member and a copper alloy member. The beryllium member comprises on its one side a thin layer of titanium, chromium, molybdenum or silicon as a diffusion inhibition layer. The beryllium member is HIP-bonded to the copper alloy member, with the diffusion inhibition layer situated between the two members. A layer of pure copper or pure nickel may be formed on the diffusion inhibition layer, as a bonding promotion layer. An aluminum layer may be formed on the surface of the beryllium member, as a stress relaxation layer on which the diffusion inhibition layer is formed. The bonded body has excellent bonding strength and thermal cycle resistance property, and can be obtained in economical manner.
REFERENCES:
T. Kuroda et al: "Development of Joining Technology for Be/Cu-alloy and Be/SS by HIP" Oct. 1997.
T. Kuroda et al: "Development of joining technology for BE/Cu-alloy and Be/SS by HIP" Journal of Nuclear Materials (Conf. Prof. Icfrm-8, Sendai JP, Oct. 26-31 1997), vol. 258-264, IX002103696 Amsterdam.
M. Araki et al: "Manufacturing and testing of a BE/OFHC-Cu divertor module" Journal of Nuclear Materials (Conf. Prof. Icfrm-7, Obninsk RU, Sep. 25-29 1995), vol. 233-237, No. Part A, 1996 pp. 632-637, XP002103697.
NGK Insulators Ltd.
Pittman Zidia T.
Ryan Patrick
LandOfFree
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