4. Metal treatment
  5. Compositions
  6. Heat treating

Takaharu Iwadachi

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Bonded body comprising beryllium member and copper or copper...

Stock material or miscellaneous articles – All metal or with adjacent metals – Having composition – density – or hardness gradient
Reexamination Certificate

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Composite bonding material of beryllium, copper alloy and...

Metal fusion bonding – Process – Diffusion type
Reexamination Certificate

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Electrically conductive spring materials

Alloys or metallic compositions – Copper base – Nickel containing
Patent

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Electroconductive spring material

Metal treatment – Compositions – Heat treating
Patent

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HIP-bonded body and method of producing the same

Metal fusion bonding – Process – Diffusion type
Patent

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Profile ID: LFUS-PAI-P-99212

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