Hinge tape

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29827, 156634, 156644, 156651, 156901, 428571, 428573, 437220, H01L 2348, H01L 2952, H01L 2944, H01L 2960

Patent

active

047219920

ABSTRACT:
In an assembly tape to be used in the tape automated bonding of semiconductor devices a single layer or two or three layer tape is described. The arrays of finger patterns created in the tape are isolated by forming transverse slots across the tape. These slots act to mechanically isolate adjacent finger patterns and improve tape flexibility. When the tape is passed under the guide shoe in an inner lead bonding machine the metal fingers will not be distorted as the tape flexes. After the semiconductor device is bonded to the tape the increased tape stiffness does not cause the tape to be deflected from its desired location with respect to the guide shoe. The slots desirably span the space between tape locator holes. If desired, the slots can be extended on the finger side of the tape to span the locator holes to form slot extension regions of reduced tape thickness. Alternatively, a slot can be formed from a plurality of shorter slots that in the aggregate perform the same function.

REFERENCES:
patent: 3768986 (1973-10-01), Ramos et al.
patent: 4259436 (1981-03-01), Tabuchi et al.
patent: 4331740 (1982-05-01), Burns
patent: 4400714 (1983-08-01), Brown
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4510017 (1985-04-01), Barber

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