Hillock-free multilayer metal lines for high performance thin fi

Details Hillock-free multilayer metal lines for high performance thin fi Hillock-free multilayer metal lines for high performance thin fi

1994-04-28

1996-05-21

Robinson, Ellis P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

428457, 428650, 428651, 428216, 437192, 437194, B32B 702, B32B 5101

Patent

active

055188052

ABSTRACT:
The present invention is a novel multilayered structure comprising alternating layers of a base metal and a metal selected from a group of barrier metals. The base metal, in any given layer, is deposited to a thickness less than its critical thickness--a thickness beyond which hillocks are more likely to form for a given temperature. Between each such layer of base metal, a layer of barrier metal is interposed. The intervening layer of barrier metal acts to suppress the formation of hillocks in the base metal.

REFERENCES:
patent: 4522890 (1985-06-01), Volkers
patent: 4673623 (1987-06-01), Gardner
patent: 5071714 (1991-12-01), Rodbell
patent: 5148259 (1992-09-01), Kato

Affiliated with

Also associated with

Rating

Hillock-free multilayer metal lines for high performance thin fi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hillock-free multilayer metal lines for high performance thin fi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hillock-free multilayer metal lines for high performance thin fi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2036553