Highly integrated multicolor light emitting device and a method

Details Highly integrated multicolor light emitting device and a method Highly integrated multicolor light emitting device and a method

1998-09-21

2000-08-08

Mulpuri, Savitri

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 28, 438 35, 438455, 438106, H01L 2144

Patent

active

061001031

ABSTRACT:
The present invention has been made in view of the above mentioned problem, and the present invention provides a highly integrated multicolor light emitting device which emits multiple colors in a chip by integrating light emitting devices of different colors, and in accordance with an aspect of the present invention, there is disclosed a light emitting device including: a plurality of light emitting elements formed on a substrate each of which comprises a plurality of semiconductor layers, wherein each of the plurality of light emitting elements radiates a light of different wavelength from one another.

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Kenzo Hatada et al., "LED Array Modules by New Technology Microbump Bonding Method", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 3, Sep. 1990, pp. 521-527.
Bill Imler, et al., "Precision Flip-Chip Solder Bump Interconnects for Optical Packaging", 1992 IEEE, pp. 508-512.

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