High-yield semi-chemical carbonate pulping process

Details High-yield semi-chemical carbonate pulping process High-yield semi-chemical carbonate pulping process

1976-03-31

1980-10-21

Bashore, S. Leon

Paper making and fiber liberation

Processes of chemical liberation, recovery or purification...

With plural or specified mechanical defibering step

162 30R, 162 90, D21C 302, D21C 1112

Patent

active

042292514

ABSTRACT:
High-yield pulp suitable for the production of corrugating medium is produced by cooking hardwood chips at a temperature 180.degree.-192.degree. with sodium carbonate solutions of a concentration 65 to 120 g/l as Na.sub.2 O, at a liquor to wood ratio of 1.2-2.5, and mechanically refining the cooked chips in a primary refining stage to a C. S. Freeness less than 480, and then refining the pulp in a secondary refining stage.

REFERENCES:
patent: 1857433 (1932-05-01), Codwise
patent: 2454532 (1948-11-01), Walter
patent: 3186899 (1965-06-01), Madison et al.
patent: 3388037 (1968-06-01), Asplund et al.
patent: 3811995 (1974-05-01), Ringley
patent: 3862909 (1975-01-01), Copeland
patent: 4073678 (1978-02-01), Hammond
Christiansen, "Effect of Sulfite Carbonate Ratio on Neutral Sulfite Semichemical Pulping", TAPPI, vol. 43, No. 6, Jun. 1960.
"The Pulping of Wood", Pulp and Paper Manufacture, vol. I, Second Ed., McGraw Hill Book Co., N.Y., 1969, pp. 226-244.
Winczakiewicz and Kaszynski, "Papier, Carton, Cellulose", 14, No. 1, 96-98, 1965.
Aronousky et al., "The Cooking Process", Industrial and Engineering Chemistry, vol. 22, No. 9, pp. 941-945.

Affiliated with

Also associated with

Rating

High-yield semi-chemical carbonate pulping process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-yield semi-chemical carbonate pulping process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-yield semi-chemical carbonate pulping process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2021436