High-work-efficiency multilayered circuit board

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C336S223000, C336S232000

Reexamination Certificate

active

06922129

ABSTRACT:
A multilayered circuit board according to the present invention includes at least first and second stacked insulating layers. The first insulating layer has thereon a first electric conductor made of a conductive film constituting an inductor and a first electrode made of a conductive film constituting a capacitor. The second insulating layer has thereon a second electrode made of a conductive film constituting a capacitor. The first and second insulating layers are stacked such that the first and second electrodes are opposed to each other through the insulating layers. Therefore this provides a circuit board having a capacitor and an inductor through the use of the two insulating layers, thus providing an inexpensive thin circuit board with small parts count and high work-efficiency compared with the use of three insulating layers in a related art.

REFERENCES:
patent: 6403199 (2002-06-01), Mori et al.
patent: 6472074 (2002-10-01), Sugimoto
patent: 2002/0030573 (2002-03-01), Mori et al.
patent: 2002/0037804 (2002-03-01), Sugimoto et al.
patent: 2004/0029701 (2004-02-01), Chikagawa et al.
patent: 11-103229 (1999-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High-work-efficiency multilayered circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-work-efficiency multilayered circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-work-efficiency multilayered circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3434076

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.