High voltage transistors with graded extension

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S410000, C257S412000, C257S414000, C257S655000, C257S666000, C257S668000, C257S669000

Reexamination Certificate

active

06888207

ABSTRACT:
High voltage transistors with high breakdown voltages are provided. These high voltage transistors are formed with graded drain extension regions. The concentration of charge carriers increases farther away from the gate across each drain extension region, causing severe electric fields to be moved away from the gate. Methods and structures of the present invention may be used to increase a transistor's breakdown voltage to the theoretical limit of the device. High voltage transistors with graded extension regions may be p-channel or n-channel MOSFETs.

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patent: 04-208571 (1992-07-01), None
Contiero et al. “Characteristics and Applications of a 0.6.mu.m Bipolar-CMOS-DMOS Technology combining VLSI Non-Volatile Memories,” IEEE, 1998.
El-Diwany et al. “1.5.mu.m Analog BiCMOS/DMOS Process for Medium Voltage and Current Power ICs Applications up to 50V,” Proceedings of the 1995 Bipolar/BiCMOS Circuits and Technology Meeting.
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Tsai et al. “16-60V Rated LDMOS Show Advanced Performance in an 0.72.mu.m Evolution BiCMOS Power Technology,” IEEE, 1997.

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