High tin solder etching solution

Details High tin solder etching solution High tin solder etching solution

2011-03-01

2011-03-01

Vinh, Lan (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

C216S083000, C134S001200, C257S779000

Reexamination Certificate

active

07897059

ABSTRACT:
A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process.

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patent: 6902869 (2005-06-01), Appelt et al.
patent: 2006/0196761 (2006-09-01), Zhao et al.
patent: 2006/0199394 (2006-09-01), Takahashi et al.
patent: 2007/0290367 (2007-12-01), Hwang

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