High-throughput thin-film fabrication vacuum flange

Details High-throughput thin-film fabrication vacuum flange High-throughput thin-film fabrication vacuum flange

2006-08-01

2006-08-01

Lebentritt, Michael (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

C257SE21023

Reexamination Certificate

active

07084445

ABSTRACT:
A mechanism and methodology is provided for performing high-throughput thin-film experimentation with the use and integration of a heater. A single flange assembly contains an automated two-dimensional shutter system (which provides variable masking schemes for spatially selective shadow deposition) and a rotatable (indexed) chip/wafer/substrate heater. The automated two-dimensional shutter system comprises two shutter plate mounts that move in two perpendicular (x and y) directions, so that mounted shutters overlap with each other in certain regions. The substrate heater can be used in the gradient temperature mode or uniform temperature mode. The shutter plates and the heater plate are detachable and exchangeable from experiment to experiment in order to minimize cross contamination of materials.

REFERENCES:
patent: 6045671 (2000-04-01), Wu et al.
patent: 6522390 (2003-02-01), Suzuki et al.

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