Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1997-10-22
1999-10-26
Mulpuri, Savitri
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438761, H01L 21469, H01L 2102
Patent
active
059728035
ABSTRACT:
This is a curing method of low-k dielectric material in a semiconductor device and system for such. The method may comprise: depositing metal interconnection lines; depositing the low-k dielectric material layer over the lines; and curing the low-k dielectric material layer with a heating lamp for less than 10 minutes, wherein the heating lamp provides optical radiation energy in the infrared spectral range of about 1 micron to 3.5 microns in wavelength. The heating lamp may be a tungsten-halogen lamp.
REFERENCES:
patent: 4385344 (1983-05-01), Gonser
patent: 4461670 (1984-07-01), Celler et al.
patent: 4510173 (1985-04-01), Higashikawa et al.
patent: 4782380 (1988-11-01), Shankar et al.
patent: 4830700 (1989-05-01), Davis et al.
patent: 4832777 (1989-05-01), Davis et al.
patent: 4842686 (1989-06-01), Davis et al.
patent: 4983546 (1991-01-01), Hyun et al.
patent: 5024969 (1991-06-01), Reche
patent: 5059448 (1991-10-01), Chandra et al.
patent: 5192715 (1993-03-01), Sliwa et al.
patent: 5236551 (1993-08-01), Pan
patent: 5248636 (1993-09-01), Davis et al.
patent: 5254497 (1993-10-01), Ciu et al.
patent: 5270259 (1993-12-01), Ito et al.
patent: 5376586 (1994-12-01), Beilin et al.
patent: 5393703 (1995-02-01), Yang et al.
patent: 5438022 (1995-08-01), Allman et al.
patent: 5458912 (1995-10-01), Camclletti et al.
patent: 5476817 (1995-12-01), Numata
patent: 5514616 (1996-05-01), Rostoker et al.
Rudolf Buchta, Dag Sigurd and Peter Revell; "Making Waves With Microwaves" Rapid Thermal Processing--vol. 14, No. 1, Jan. 1992.
Davis Cecil J.
Hwang Ming-Jang
Moslehi Mehrdad M.
Shu Jing Shing
Donaldson Richard L.
Hoel Carlton H.
Mulpuri Savitri
Texas Instruments Incorporated
Valetti Mark A.
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