High throughput method of in transit wafer position...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Robot control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C700S217000, C700S218000, C700S245000, C700S249000, C700S250000, C414S217000, C414S222010, C414S416030, C414S416080, C414S744200, C901S002000, C901S006000, C901S008000, C901S009000, C901S014000, C318S568110, C318S568120, C318S568210, C118S715000, C118S719000, C118S729000, C356S614000

Reexamination Certificate

active

08060252

ABSTRACT:
Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.

REFERENCES:
patent: 5001327 (1991-03-01), Hirasawa et al.
patent: 5483138 (1996-01-01), Shmookler et al.
patent: 5563798 (1996-10-01), Berken et al.
patent: 5564889 (1996-10-01), Araki
patent: 5706201 (1998-01-01), Andrews
patent: 5855681 (1999-01-01), Maydan et al.
patent: 6198976 (2001-03-01), Sundar et al.
patent: 6315512 (2001-11-01), Tabrizi et al.
patent: 6405101 (2002-06-01), Johanson et al.
patent: 6430468 (2002-08-01), Tepman et al.
patent: 6508883 (2003-01-01), Tanguay
patent: 6568552 (2003-05-01), Tabrizi et al.
patent: 6610150 (2003-08-01), Savage et al.
patent: 6760976 (2004-07-01), Martinson et al.
patent: 7357842 (2008-04-01), Ishikawa et al.
patent: 7658586 (2010-02-01), Niewmierzycki et al.
patent: 7694647 (2010-04-01), Ishikawa et al.
patent: 7743728 (2010-06-01), Ishikawa et al.
patent: 7925377 (2011-04-01), Ishikawa et al.
patent: 2001/0020199 (2001-09-01), Bacchi et al.
patent: 2002/0053509 (2002-05-01), Hanson et al.
patent: 2002/0098072 (2002-07-01), Sundar
patent: 2003/0202865 (2003-10-01), Ponnekanti et al.
patent: 2005/0137751 (2005-06-01), Cox et al.
patent: 2005/0265814 (2005-12-01), Coady
patent: 2006/0039781 (2006-02-01), Niewmierzycki et al.
patent: 2006/0045664 (2006-03-01), Niewmierzycki et al.
patent: 2008/0152463 (2008-06-01), Chidambaram et al.
patent: 2009/0142163 (2009-06-01), Genetti et al.
patent: 2009/0143911 (2009-06-01), Gage et al.
patent: 2010/0278623 (2010-11-01), Blank et al.
U.S. Appl. No. 11/998,857, “Wafer position correction with a dual, side-by-side wafer transfer robot”, Genetti et al., filed Nov. 30, 2007.
U.S. Appl. No. 11/998,857, Office Action mailed Jun. 24, 2011.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High throughput method of in transit wafer position... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughput method of in transit wafer position..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughput method of in transit wafer position... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4256281

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.