Data processing: generic control systems or specific application – Specific application – apparatus or process – Robot control
Reexamination Certificate
2007-11-30
2011-11-15
Trammell, James (Department: 3667)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Robot control
C700S217000, C700S218000, C700S245000, C700S249000, C700S250000, C414S217000, C414S222010, C414S416030, C414S416080, C414S744200, C901S002000, C901S006000, C901S008000, C901S009000, C901S014000, C318S568110, C318S568120, C318S568210, C118S715000, C118S719000, C118S729000, C356S614000
Reexamination Certificate
active
08060252
ABSTRACT:
Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.
REFERENCES:
patent: 5001327 (1991-03-01), Hirasawa et al.
patent: 5483138 (1996-01-01), Shmookler et al.
patent: 5563798 (1996-10-01), Berken et al.
patent: 5564889 (1996-10-01), Araki
patent: 5706201 (1998-01-01), Andrews
patent: 5855681 (1999-01-01), Maydan et al.
patent: 6198976 (2001-03-01), Sundar et al.
patent: 6315512 (2001-11-01), Tabrizi et al.
patent: 6405101 (2002-06-01), Johanson et al.
patent: 6430468 (2002-08-01), Tepman et al.
patent: 6508883 (2003-01-01), Tanguay
patent: 6568552 (2003-05-01), Tabrizi et al.
patent: 6610150 (2003-08-01), Savage et al.
patent: 6760976 (2004-07-01), Martinson et al.
patent: 7357842 (2008-04-01), Ishikawa et al.
patent: 7658586 (2010-02-01), Niewmierzycki et al.
patent: 7694647 (2010-04-01), Ishikawa et al.
patent: 7743728 (2010-06-01), Ishikawa et al.
patent: 7925377 (2011-04-01), Ishikawa et al.
patent: 2001/0020199 (2001-09-01), Bacchi et al.
patent: 2002/0053509 (2002-05-01), Hanson et al.
patent: 2002/0098072 (2002-07-01), Sundar
patent: 2003/0202865 (2003-10-01), Ponnekanti et al.
patent: 2005/0137751 (2005-06-01), Cox et al.
patent: 2005/0265814 (2005-12-01), Coady
patent: 2006/0039781 (2006-02-01), Niewmierzycki et al.
patent: 2006/0045664 (2006-03-01), Niewmierzycki et al.
patent: 2008/0152463 (2008-06-01), Chidambaram et al.
patent: 2009/0142163 (2009-06-01), Genetti et al.
patent: 2009/0143911 (2009-06-01), Gage et al.
patent: 2010/0278623 (2010-11-01), Blank et al.
U.S. Appl. No. 11/998,857, “Wafer position correction with a dual, side-by-side wafer transfer robot”, Genetti et al., filed Nov. 30, 2007.
U.S. Appl. No. 11/998,857, Office Action mailed Jun. 24, 2011.
Gage Chris
Genetti Damon
Marc McDieunel
Novellus Systems Inc.
Trammell James
Weaver Austin Villeneuve & Sampson LLP
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