Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2007-01-16
2007-01-16
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S239100, C359S196100
Reexamination Certificate
active
10983078
ABSTRACT:
The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the defect data and a dual mode defect decision algorithm and post processor assess defects. Darkfield radiation is provided by two adjustable height laser beams Vertical angular adjustability is provided by modifying cylindrical lens position to compensate for angular mirror change by translating an adjustable mirror, positioning the illumination spot into the sensor field of view, rotating and subsequently moving the cylindrical lens. A brightfield beamsplitter in the system is removable, and preferably replaced with a blank when performing darkfield illumination. Light level control for the system is provided by a dual polarizer first stage.
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Fairley Christopher R
Fu Tao-Yi
Perelman Gershon
Tsai Bin-Ming Benjamin
KLA-Tencor Technologies Corporation
Pham Hoa Q.
Smyrski Law Group, A P.C.
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