Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-10-18
2005-10-18
Tarazano, D. Lawrence (Department: 1773)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S713000, C361S714000, C428S348000, C428S515000, C428S523000, C524S399000, C524S400000, C524S404000
Reexamination Certificate
active
06956739
ABSTRACT:
A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).
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Molnar, Jr. John A.
Parker-Hannifin Corporation
Tarazano D. Lawrence
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