High temperature drop-off of a substrate

Electric resistance heating devices – Heating devices – Radiant heater

Reexamination Certificate

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Details

C118S725000

Reexamination Certificate

active

10654068

ABSTRACT:
A substrate to be processed in a high temperature processing chamber is preheated to avoid the problems associated with thermal shock when the substrate is dropped onto a heated susceptor. Preheating is effected by holding the substrate over a susceptor maintained at or near the processing temperature until the temperature of the substrate approaches the processing temperature. Thus, wafer warping and breakage are greatly reduced, and wafer throughput is improved because of time saved in maintaining the susceptor at constant temperature without cool down and reheat periods.

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