High-speed symmetrical plasma treatment system

Details High-speed symmetrical plasma treatment system High-speed symmetrical plasma treatment system

2005-12-06

2005-12-06

Kackar, Ram N (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345510, C156S345330, C118S715000, C118S7230AN, C118S728000, C204S192100, C204S298020, C216S067000, C427S534000, C438S710000

Reexamination Certificate

active

06972071

ABSTRACT:
A plasma treatment system (10) and related methods for rapidly treating a workpiece (56) with ions from a plasma having an ion density that is reproducibly uniform and symmetrical. The processing chamber (12) of the plasma treatment system (10) includes a chamber (14) lid having a symmetrical array of apertures (192) and further includes a vacuum distribution baffle (180), which are both configured to uniformly disperse a process gas adjacent the surface of the workpiece (56). The uniform dispersion of process gas and a symmetrical placement of the workpiece within the chamber (12) contribute to providing a uniformly dense plasma of ions adjacent the workpiece (56). A treatment system control (304) automates the operation of the system and controls the flow of process gas, evacuation of the chamber, and the application of the plasma excitation power to minimize the length of a treatment cycle and to optimize the uniformity of the plasma treatment.

REFERENCES:
patent: 3294670 (1966-12-01), Charschan et al.
patent: 3641973 (1972-02-01), Shrader
patent: 4208159 (1980-06-01), Uehara et al.
patent: 4252595 (1981-02-01), Yamamoto et al.
patent: 4278528 (1981-07-01), Kuehnle et al.
patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4336438 (1982-06-01), Uehara et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4418639 (1983-12-01), Wills et al.
patent: 4550239 (1985-10-01), Uehara et al.
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4575299 (1986-03-01), Layton
patent: 4584045 (1986-04-01), Richards
patent: 4637853 (1987-01-01), Bumble et al.
patent: 4705444 (1987-11-01), Tullis et al.
patent: 4770121 (1988-09-01), Ebata et al.
patent: 4816116 (1989-03-01), Davis
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4840702 (1989-06-01), Schumacher, III
patent: 4889609 (1989-12-01), Cannella
patent: 5030056 (1991-07-01), Kitayama et al.
patent: 5044871 (1991-09-01), Davis et al.
patent: 5079031 (1992-01-01), Yamazaki et al.
patent: 5086729 (1992-02-01), Katagiri
patent: 5116640 (1992-05-01), Mikami et al.
patent: 5216223 (1993-06-01), Straemke
patent: 5259942 (1993-11-01), Kempf
patent: 5286296 (1994-02-01), Sato
patent: 5288684 (1994-02-01), Yamazaki et al.
patent: 5292393 (1994-03-01), Maydan
patent: 5302077 (1994-04-01), Sato
patent: 5303671 (1994-04-01), Kondo et al.
patent: 5310410 (1994-05-01), Begin
patent: 5314298 (1994-05-01), Kim
patent: 5345056 (1994-09-01), Frei et al.
patent: 5387265 (1995-02-01), Kakizaki et al.
patent: 5413673 (1995-05-01), Fujimoto
patent: 5433371 (1995-07-01), Morisako
patent: 5480052 (1996-01-01), Furr et al.
patent: 5492265 (1996-02-01), Wandke
patent: 5515986 (1996-05-01), Turlot et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5573597 (1996-11-01), Lantsman
patent: 5576629 (1996-11-01), Turner et al.
patent: 5587205 (1996-12-01), Saito et al.
patent: 5605637 (1997-02-01), Shan et al.
patent: 5609290 (1997-03-01), Bobbio et al.
patent: 5634765 (1997-06-01), Miyoshi
patent: 5647942 (1997-07-01), Haji
patent: 5660744 (1997-08-01), Sekine et al.
patent: 5707485 (1998-01-01), Rolfson et al.
patent: 5710407 (1998-01-01), Moore et al.
patent: 5767008 (1998-06-01), Haji
patent: 5779807 (1998-07-01), Dornfest et al.
patent: 5823416 (1998-10-01), Haji
patent: 5919332 (1999-07-01), Koshiishi et al.
patent: 5958510 (1999-09-01), Sivaramakrishnam et al.
patent: 5972163 (1999-10-01), Haji
patent: 6035804 (2000-03-01), Arami et al.
patent: 6050216 (2000-04-01), Szapucki et al.
patent: 6050446 (2000-04-01), Lei et al.
patent: 6093904 (2000-07-01), Haji
patent: 6129808 (2000-10-01), Wicker et al.
patent: 6267074 (2001-07-01), Okumura
patent: 6331347 (2001-12-01), Haji
patent: 6352593 (2002-03-01), Brors et al.
patent: 3935002 (1991-04-01), None
patent: 59-164696 (1984-09-01), None
patent: 60202937 (1985-10-01), None
patent: 03-023137 (1991-01-01), None
patent: 03002377 (1991-01-01), None
patent: 03-159143 (1991-07-01), None
patent: 04-123430 (1992-04-01), None
patent: 04-311044 (1992-11-01), None
patent: 6-21032 (1994-01-01), None
patent: 2828066 (1998-09-01), None
Panasonic Factory Automation Company,Plasma Cleaning Systems, Brochure, Nov. 2000.
Panasonic Factory Automation Company, Japanese Brochure, Nov. 2000.
March Instruments, Inc.,In-Line Plasma System, Brochure, Aug. 1995.
March Instruments, Inc.,TAC Technology Advancement Center, Brochure, Feb. 1995.
Materials Research Corporation,1.12 Inline production magnetron sputtering, Journal Article, 3 pages.
Von Dr.-Ing M. Nowottnick, Fraunhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration (IZM), Berlin,Plasmabehandlung als umweltfreundliche Alternative in der Leiterplattenfertigung, Galvanotechnik D-88348 Saulgau 86 (1995) Nr. 4; Journal Article, 6 pages.

Affiliated with

Also associated with

Rating

High-speed symmetrical plasma treatment system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-speed symmetrical plasma treatment system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-speed symmetrical plasma treatment system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3514350