Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-07-29
2008-08-19
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
Reexamination Certificate
active
07414322
ABSTRACT:
The embodiments of the present invention are directed toward the design of routing patterns, including elements such as contacts, traces, and vias, for high speed differential signal pairs in integrated circuit package substrates.
REFERENCES:
patent: 5994766 (1999-11-01), Shenoy et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 7133294 (2006-11-01), Patel et al.
patent: 2001/0013650 (2001-08-01), Goetz et al.
patent: 2004/0075991 (2004-04-01), Haba et al.
Miller Leah M.
Winn Gregory S.
Jahan Bilkis
Louie Wai-Sing
LSI Corporation
Luedeka Neely & Graham, P.C
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