High speed etching of polyimide film

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156644, 156654, 252 795, B29C 1708, B44C 122, C03C 1500, C03C 2506

Patent

active

044262531

ABSTRACT:
An aqueous solution of ethyl or propyl alcohol containing a basic compound such as KOH is shown to etch the surface of polyimide material up to 400 times faster than conventional aqueous KOH etching solutions.

REFERENCES:
patent: 3361589 (1968-01-01), Lindsey
patent: 3770528 (1973-11-01), Hermes
patent: 3791848 (1974-02-01), DeAngelo
patent: 4369090 (1983-01-01), Wilson et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High speed etching of polyimide film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High speed etching of polyimide film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High speed etching of polyimide film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-699497

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.