High-speed electron beam inspection

Radiant energy – Inspection of solids or liquids by charged particles – Electron probe type

Reexamination Certificate

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Details

C250S306000, C250S307000, C250S397000

Reexamination Certificate

active

11031091

ABSTRACT:
One embodiment disclosed relates to an electron beam apparatus for inspection of a semiconductor wafer, wherein substantially an entire area of the wafer surface is scanned without moving the stage. A cathode ray tube (CRT) gun may be used to rapidly (and cost effectively) scan the beam over the wafer. Another embodiment disclosed relates to a high-speed automated e-beam inspector configured to scan the e-beam in one dimension while translating the wafer in a perpendicular direction. The translation may be linear, or alternatively, may be in a spiral path. Other embodiments are also disclosed.

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Stan Stokowski et al., “Wafer Inspection Technology Challenges for ULSI Manufacturing” KLA-Tencor, Milpitas, CA.
Stan Stokowski, et al. “Wafer inspection technology challenges for ULSI manufacturing”, 11 sheets, KLA-Tencor, Milpitas, California.

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