High speed bus with radio frequency microstrip

Details High speed bus with radio frequency microstrip High speed bus with radio frequency microstrip

2007-07-24

2007-07-24

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

Reexamination Certificate

active

10847507

ABSTRACT:
A method for preparing a printed circuit board and an apparatus are provided to decrease losses associated with high speed signal propagation. The printed circuit board has at least two conductive layers separated by an dielectric layer formed of a dielectric material. A conductive path is formed in one of the conductive layers for propagation of the high speed signal. At least a portion of the dielectric layer is removed on both sides of and adjacent to the conductive path. The removed portion extends in the dielectric layer between the conductive layers from one to the other and includes a hole shaped portion and a trough shaped portion. The removed portion does not extend beyond the dielectric layer.

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