High sensitivity crosslinkable photoresist composition,...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S270100, C430S318000, C430S323000

Reexamination Certificate

active

07037638

ABSTRACT:
A high sensitivity, organic solvent developable, high resolution photoresist composition for use in E-beam lithography is disclosed. The composition of the present invention comprises a high sensitivity, soluble, film forming photoresist composition of dendrimeric calix [4]arene derivatives and processes for forming lithographic patterns with a crosslinker selected from glycoluril derivatives capable of reacting with these dendrimer under acid catalysis, a photoacid generator and an organic solvent. The composition of the present invention is particularly useful for production of negative tone images of high resolution (less than 100 nanometers).

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patent: 2000-264953 (2000-09-01), None
Onishi et al, 118:49297, Chemical Abstracts, ACS CAPLUS online, English abstract of Japanese laid open application JP 04-155342A2, one page.
Takeshi et al, 131:293201, Chemical Abstracts, ACS CA online, English abstract of POlym. Mater. Sci. Eng. (1999), vol. 81, pp. 85-86, two pages.
Nakayama et al, 131:221141 ACS CA online, English abstract of J. Photopolym, Sci. Technol. (1999), 12 (2), pp. 347-352, 2 pages.
Ueda et al, 127:270392, Chemical Abstracts, ACS CA online, English abstract of Polym. mater. Sci. Engl. (1997), 77, pp. 455-456, one page.

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