High resolution thermal printing device

Recorders – Thermal recording

Patent

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Details

B41J 234, G01D 1510, G01D 1516

Patent

active

050972715

ABSTRACT:
There is disclosed a high resolution thermal printing device including a 128-bit uni-directional integrated circuit, which is specially ordered, instead of a general integrated circuit. The electrical connection of the device is achieved by wedge wire bonding employing wedges. The integrated circuit has a plurality of power source connecting pads which are aligned on the central portion the integrated circuit in parallel with the transverse direction thereof.

REFERENCES:
patent: 4750260 (1988-06-01), Takeno et al.

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