Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1985-04-05
1987-02-24
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430315, 430318, 430319, G03C 500
Patent
active
046457330
ABSTRACT:
High resolution, high packing density printed circuit wiring with high conductivity wiring is achieved by putting down thick (0.006 in., 0.015 cm) liquid photopolymer insulator layers on an inexpensive substrate and photodeveloping conductor pattern indentations in the layer for filling with conductive materials. Thus, 0.003 in. (0.008 cm) line to line spacings can be achieved with high conductivity conductors 0.006 in. (0.015 cm) thick. A flush top layer of polymer is readily cleaned of contaminants by light surface sanding to assure designed insulation spacings of polymer between conductors without interfering smears. The finished circuits are not subject to damage in handling from surface scratches since the conductors are indented.
REFERENCES:
patent: 2585700 (1952-02-01), Strickman
patent: 3605260 (1971-09-01), Spridco et al.
patent: 3791858 (1974-02-01), McPherson et al.
patent: 4307179 (1981-12-01), Chang et al.
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4521449 (1985-06-01), Arnold et al.
patent: 4532152 (1985-07-01), Elarde
Brown Laurence R.
Kittle John E.
Ryan Patrick J.
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