Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-11-21
2006-11-21
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S624000
Reexamination Certificate
active
07138330
ABSTRACT:
A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
REFERENCES:
patent: 3294653 (1966-12-01), Keller et al.
patent: 3379568 (1968-04-01), Holmes
patent: 4911796 (1990-03-01), Reed
patent: 4952420 (1990-08-01), Walters
patent: 6262376 (2001-07-01), Hurwitz et al.
patent: 2002/0106887 (2002-08-01), Chang
patent: 2002/0122283 (2002-09-01), Mitsutoshi et al.
patent: 2003/0007251 (2003-01-01), Imaizumi et al.
patent: 2003/0016116 (2003-01-01), Blaha
patent: 2004/0055893 (2004-03-01), Lubomirsky et al.
patent: 2004/0061234 (2004-04-01), Shah et al.
patent: 0 329 973 (1989-08-01), None
patent: 0 525 497 (1993-02-01), None
patent: 0 529 752 (1993-03-01), None
patent: 0 713 358 (1996-05-01), None
patent: 1 096 838 (2001-05-01), None
patent: 1102832 (1968-02-01), None
patent: 1348659 (1974-03-01), None
patent: WO 89/02697 (1989-03-01), None
PCT International Search Report as issued in International Application No. PCT/US04/028600, Mailing date Mar. 16, 2005.
Dr. J. Prymak; Dr. S. Bhattacharya & Prof. K. Paik-Fundamentals of Passives: Discrete Integrated, and Embedded(CH. 11)-Fundamentals of Microsystems Packaging, 2001.
T. Remmel; P. Zurcher; M. Kim; M. Miller; M. Raymond; S. Straub; M. Tarabbia; R. Steimle & P. Chu-Integration of Thin-Film Capacitors and Resistors into ULSI Technology for Wireless Applications-Passive Component Industry, Jan./Feb. 2001.
CH 6—Thermal Transducers-Micromachined Transducers Sourcebook.
J.J. Licari-Thin and Thick Films(CH 8)-.
EP Search Report as issued in International Application No. 03754668.6 2214, Mailing date Oct. 24, 2005.
Young W. Kim, et al.;Single-and multi-layer surface-micromachined platforms using electroplated sacrificial layrs; Sensor and Actuators (Trandsucers '91) Jun. 24-28, 1991, San Francisco, CA, USA.
Pendo Shaun
Shah Rajiv
Medtronic Minimed Inc.
Pham Long
LandOfFree
High reliability multilayer circuit substrates and methods... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High reliability multilayer circuit substrates and methods..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High reliability multilayer circuit substrates and methods... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3666063