High rate chemical vapor deposition of carbon films using fluori

Details High rate chemical vapor deposition of carbon films using fluori High rate chemical vapor deposition of carbon films using fluori

1991-03-15

1993-03-30

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427249, 427122, 427570, B05D 306, C23C 1626

Patent

active

051982633

ABSTRACT:
A high rate, low-temperature deposition of amorphous carbon films is produced by PE-CVD in the presence of a fluorinated or other halide gas. The deposition can be performed at less than 100.degree. C., including ambient room temperature, with a radio frequency plasma assisted chemical vapor deposition process. With less than 6.5 atomic percent fluorine incorporated into the amorphous carbon film, the characteristics of the carbon film, including index of refraction, mass density, optical clarity, and chemical resistance are within fifteen percent (15%) of those characteristics for pure amorphous carbon films, but the deposition rates are high.

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F. Ishaikawa et al., Study on Hydrophobic a-C:h:F Overcoat Layer for a-Si:H Photoreceptor, Materials Research Society Symposium Proceeding, vol. 118, pp. 429-434 (1988).

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