High-radiance emitters with integral microlens

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156648, 156654, 156656, 156662, 427 77, 357 17, 313498, 313499, 313110, H01L 21306

Patent

active

042796903

ABSTRACT:
This invention deals with the fabrication of radiation emitting diodes having a small diameter shaped integral microlens formed by etching. Initially an oxide layer is deposited on the backside of the processed slice; then a ring pattern is opened in the oxide. An etch is used to form a ring groove with a mesa in the center. The center oxide dot over the mesa is removed and the etching continued to round off the edges of the mesa and to form a smooth shaped structure. Various shapes and diameters may be achieved with different ring dimensions and with different etch times.

REFERENCES:
patent: 3443140 (1969-05-01), Ing
patent: 3512027 (1970-05-01), Kupsky
patent: 3703670 (1972-11-01), Kunz
patent: 3767493 (1973-10-01), Kump
patent: 3877052 (1975-04-01), Dixon
patent: 3954534 (1976-05-01), Scifres

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