Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1977-09-19
1981-07-21
Smith, Ronald H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156648, 156654, 156656, 156662, 427 77, 357 17, 313498, 313499, 313110, H01L 21306
Patent
active
042796903
ABSTRACT:
This invention deals with the fabrication of radiation emitting diodes having a small diameter shaped integral microlens formed by etching. Initially an oxide layer is deposited on the backside of the processed slice; then a ring pattern is opened in the oxide. An etch is used to form a ring groove with a mesa in the center. The center oxide dot over the mesa is removed and the etching continued to round off the edges of the mesa and to form a smooth shaped structure. Various shapes and diameters may be achieved with different ring dimensions and with different etch times.
REFERENCES:
patent: 3443140 (1969-05-01), Ing
patent: 3512027 (1970-05-01), Kupsky
patent: 3703670 (1972-11-01), Kunz
patent: 3767493 (1973-10-01), Kump
patent: 3877052 (1975-04-01), Dixon
patent: 3954534 (1976-05-01), Scifres
Bueker Richard
Donaldson Rich
Honeycutt Gary
Sharp Mel
Smith Ronald H.
LandOfFree
High-radiance emitters with integral microlens does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-radiance emitters with integral microlens, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-radiance emitters with integral microlens will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2432863