High quantum efficiency silicon nanoparticle embedded SiO X...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S787000, C438S791000, C313S503000

Reexamination Certificate

active

07902088

ABSTRACT:
A method is provided for fabricating a high quantum efficiency silicon (Si) nanoparticle embedded SiOXNYfilm for luminescence (electroluminescence—EL and photoluminescence—PL) applications. The method provides a bottom electrode, and deposits a Si nanoparticle embedded non-stoichiometric SiOXNYfilm, where (X+Y<2 and Y>0), overlying the bottom electrode. The Si nanoparticle embedded SiOXNYfilm is annealed. The annealed Si nanoparticle embedded SiOXNYfilm has an extinction coefficient (k) of less than about 0.001 as measured at 632 nanometers (nm), and a PL quantum efficiency (PLQE) of greater than 20%.

REFERENCES:
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patent: 2004/0106285 (2004-06-01), Zacharias
patent: 2006/0180817 (2006-08-01), Hsu et al.
patent: 1315508 (2003-10-01), None
Ferraioli et al., “Dielectric matrix influence on the photoluminescence properties of silicon nanocrystals”, Sep. 13-15, 2006, IEEE, p. 225-227.
Castagna et al., “High efficiency light emission devices in Si”, Mat. Res. Soc. Symp. Proc., vol. 770, p. 12.1.1 (2003).

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