Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2003-08-11
2009-10-27
Sheehan, John P. (Department: 1793)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192380, C148S425000, C148S313000, C420S435000
Reexamination Certificate
active
07608172
ABSTRACT:
The method manufactures high-purity ferromagnetic sputter targets by cryogenic working the sputter target blank at a temperature below at least −50° C. to impart at least about 5 percent strain into the sputter target blank to increase PTF uniformity of the target blank. The sputter target blank is a nonferrous metal selected from the group consisting of cobalt and nickel; and the nonferrous metal has a purity of at least about 99.99 weight percent. Finally, fabricating the sputter target blank forms a sputter target having an improved PTF uniformity arising from the cryogenic working.
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Dombrowski David E.
Hunt Thomas J.
Koenigsmann Holger J.
Perry Andrew C.
Praxair S.T. Technology, Inc.
Schwartz Iurie A.
Sheehan John P.
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