High pressure processing chamber for semiconductor substrate

Details High pressure processing chamber for semiconductor substrate High pressure processing chamber for semiconductor substrate

2005-07-26

2005-07-26

Lund, Jeffrie R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C118S719000, C118S715000, C118S733000, C134S001100, C134S001200, C134S001300, C156S345330

Reexamination Certificate

active

06921456

ABSTRACT:
A high pressure chamber comprises a chamber housing, a platen, and a mechanical drive mechanism. The chamber housing comprises a first sealing surface. The platen comprises a region for holding the semiconductor substrate and a second sealing surface. The mechanical drive mechanism couples the platen to the chamber housing. In operation, the mechanical drive mechanism separates the platen from the chamber housing for loading of the semiconductor substrate. In further operation, the mechanical drive mechanism causes the second sealing surface of the platen and the first sealing surface of the chamber housing to form a high pressure processing chamber around the semiconductor substrate.

REFERENCES:
patent: 2617719 (1952-11-01), Stewart
patent: 2625886 (1953-01-01), Browne
patent: 3744660 (1973-07-01), Gaines et al.
patent: 3968885 (1976-07-01), Hassan et al.
patent: 4029517 (1977-06-01), Rand
patent: 4091643 (1978-05-01), Zucchini
patent: 4245154 (1981-01-01), Uehara et al.
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4355937 (1982-10-01), Mack et al.
patent: 4367140 (1983-01-01), Wilson
patent: 4406596 (1983-09-01), Budde
patent: 4422651 (1983-12-01), Platts
patent: 4474199 (1984-10-01), Blaudszun
patent: 4522788 (1985-06-01), Sitek et al.
patent: 4549467 (1985-10-01), Wilden et al.
patent: 4592306 (1986-06-01), Gallego
patent: 4601181 (1986-07-01), Privat
patent: 4626509 (1986-12-01), Lyman
patent: 4670126 (1987-06-01), Messer et al.
patent: 4682937 (1987-07-01), Credle, Jr.
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4778356 (1988-10-01), Hicks
patent: 4788043 (1988-11-01), Kagiyama et al.
patent: 4789077 (1988-12-01), Noe
patent: 4823976 (1989-04-01), White, III et al.
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4827867 (1989-05-01), Takei et al.
patent: 4838476 (1989-06-01), Rahn
patent: 4865061 (1989-09-01), Fowler et al.
patent: 4879431 (1989-11-01), Bertoncini
patent: 4917556 (1990-04-01), Stark et al.
patent: 4924892 (1990-05-01), Kiba et al.
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4960140 (1990-10-01), Ishijima et al.
patent: 4983223 (1991-01-01), Gessner
patent: 5011542 (1991-04-01), Weil
patent: 5013366 (1991-05-01), Jackson et al.
patent: 5044871 (1991-09-01), Davis et al.
patent: 5062770 (1991-11-01), Story et al.
patent: 5068040 (1991-11-01), Jackson
patent: 5071485 (1991-12-01), Matthews et al.
patent: 5105556 (1992-04-01), Kurokawa et al.
patent: 5143103 (1992-09-01), Basso et al.
patent: 5167716 (1992-12-01), Boitnott et al.
patent: 5169296 (1992-12-01), Wilden
patent: 5169408 (1992-12-01), Biggerstaff et al.
patent: 5185296 (1993-02-01), Morita et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5188515 (1993-02-01), Horn
patent: 5190373 (1993-03-01), Dickson et al.
patent: 5191993 (1993-03-01), Wanger et al.
patent: 5193560 (1993-03-01), Tanaka et al.
patent: 5195878 (1993-03-01), Sahiavo et al.
patent: 5213485 (1993-05-01), Wilden
patent: 5213619 (1993-05-01), Jackson et al.
patent: 5215592 (1993-06-01), Jackson
patent: 5217043 (1993-06-01), Novakovic
patent: 5221019 (1993-06-01), Pechacek et al.
patent: 5222876 (1993-06-01), Budde
patent: 5224504 (1993-07-01), Thompson et al.
patent: 5236602 (1993-08-01), Jackson
patent: 5236669 (1993-08-01), Simmons et al.
patent: 5237824 (1993-08-01), Pawliszyn
patent: 5240390 (1993-08-01), Kvinge et al.
patent: 5243821 (1993-09-01), Schuck et al.
patent: 5246500 (1993-09-01), Samata et al.
patent: 5251776 (1993-10-01), Morgan, Jr. et al.
patent: 5267455 (1993-12-01), Dewees et al.
patent: 5280693 (1994-01-01), Heudecker
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5304515 (1994-04-01), Morita et al.
patent: 5306350 (1994-04-01), Hoy et al.
patent: 5313965 (1994-05-01), Palen
patent: 5314574 (1994-05-01), Takahashi
patent: 5316591 (1994-05-01), Chao et al.
patent: 5328722 (1994-07-01), Ghanayem et al.
patent: 5337446 (1994-08-01), Smith et al.
patent: 5339844 (1994-08-01), Stanford, Jr. et al.
patent: 5355901 (1994-10-01), Mielnik et al.
patent: 5368171 (1994-11-01), Jackson
patent: 5370740 (1994-12-01), Chao et al.
patent: 5370741 (1994-12-01), Bergman
patent: 5377705 (1995-01-01), Smith, Jr. et al.
patent: 5401322 (1995-03-01), Marshall
patent: 5403621 (1995-04-01), Jackson et al.
patent: 5404894 (1995-04-01), Shiraiwa
patent: 5412958 (1995-05-01), Iliff et al.
patent: 5417768 (1995-05-01), Smith, Jr. et al.
patent: 5433334 (1995-07-01), Reneau
patent: 5447294 (1995-09-01), Sakata et al.
patent: 5456759 (1995-10-01), Stanford, Jr. et al.
patent: 5494526 (1996-02-01), Paranjpe
patent: 5500081 (1996-03-01), Bergman
patent: 5501761 (1996-03-01), Evans et al.
patent: 5503176 (1996-04-01), Dunmire et al.
patent: 5505219 (1996-04-01), Lansberry et al.
patent: 5509431 (1996-04-01), Smith, Jr. et al.
patent: 5522938 (1996-06-01), O'Brien
patent: 5526834 (1996-06-01), Mielnik et al.
patent: 5533538 (1996-07-01), Marshall
patent: 5571330 (1996-11-01), Kyogoku
patent: 5589224 (1996-12-01), Tepman et al.
patent: 5621982 (1997-04-01), Yamashita et al.
patent: 5629918 (1997-05-01), Ho et al.
patent: 5644855 (1997-07-01), McDermott et al.
patent: 5649809 (1997-07-01), Stapelfeldt
patent: 5656097 (1997-08-01), Olesen et al.
patent: 5669251 (1997-09-01), Townsend et al.
patent: 5672204 (1997-09-01), Habuka
patent: 5683977 (1997-11-01), Jureller et al.
patent: 5702228 (1997-12-01), Tamai et al.
patent: 5706319 (1998-01-01), Holtz
patent: 5746008 (1998-05-01), Yamashita et al.
patent: 5797719 (1998-08-01), James et al.
patent: 5798126 (1998-08-01), Fujikawa et al.
patent: 5817178 (1998-10-01), Mita et al.
patent: 5868856 (1999-02-01), Douglas et al.
patent: 5868862 (1999-02-01), Douglas et al.
patent: 5881577 (1999-03-01), Sauer et al.
patent: 5882165 (1999-03-01), Maydan et al.
patent: 5888050 (1999-03-01), Fitzgerald et al.
patent: 5898727 (1999-04-01), Fujikawa et al.
patent: 5900107 (1999-05-01), Murphy et al.
patent: 5900354 (1999-05-01), Batchelder
patent: 5904737 (1999-05-01), Preston et al.
patent: 5908510 (1999-06-01), McCullough et al.
patent: 5928389 (1999-07-01), Jevtic
patent: 5932100 (1999-08-01), Yager et al.
patent: 5934991 (1999-08-01), Rush
patent: 5955140 (1999-09-01), Smith et al.
patent: 5976264 (1999-11-01), McCullough et al.
patent: 5979306 (1999-11-01), Fujikawa et al.
patent: 5980648 (1999-11-01), Adler
patent: 5981399 (1999-11-01), Kawamura et al.
patent: 5989342 (1999-11-01), Ikeda et al.
patent: 6005226 (1999-12-01), Aschner et al.
patent: 6017820 (2000-01-01), Ting et al.
patent: 6024801 (2000-02-01), Wallace et al.
patent: 6029371 (2000-02-01), Kamikawa et al.
patent: 6035871 (2000-03-01), Eui-Yeol
patent: 6037277 (2000-03-01), Masakara et al.
patent: 6053348 (2000-04-01), Morch
patent: 6056008 (2000-05-01), Adams et al.
patent: 6067728 (2000-05-01), Farmer et al.
patent: 6077053 (2000-06-01), Fujikawa et al.
patent: 6082150 (2000-07-01), Stucker
patent: 6085935 (2000-07-01), Malchow et al.
patent: 6097015 (2000-08-01), McCullough et al.
patent: 6110232 (2000-08-01), Chen et al.
patent: 6128830 (2000-10-01), Bettcher et al.
patent: 6145519 (2000-11-01), Konishi et al.
patent: 6149828 (2000-11-01), Vaartstra
patent: 6159295 (2000-12-01), Maskara et al.
patent: 6164297 (2000-12-01), Kamikawa
patent: 6186722 (2001-02-01), Shirai
patent: 6203582 (2001-03-01), Berner et al.
patent: 6216364 (2001-04-01), Tanaka et al.
patent: 6228563 (2001-05-01), Starov et al.
patent: 6235634 (2001-05-01), White et al.
patent: 6239038 (2001-05-01), Wen
patent: 6241825 (2001-06-01), Wytman
patent: 6242165 (2001-06-01), Vaartstra
patent: 6244121 (2001-06-01), Hunter
patent: 6251250 (2001-06-01), Keigler
patent: 6277753 (2001-08-01), Mullee et al.
patent: 6286231 (2001-09-01), Bergman et al.
patent: 6305677 (2001-10-01), Lenz
patent: 6319858 (2001-11-01), Lee et al.
patent: 6334266 (2002-01-01), Moritz et al.
patent: 6344174 (2002-02-01), Miller et al.
patent: 6388317 (2002-05-01), Reese
patent: 6389677 (2002-05-01), Lenz
patent: 6418956 (2002-

Affiliated with

Also associated with

Rating

High pressure processing chamber for semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High pressure processing chamber for semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High pressure processing chamber for semiconductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3393221