High-pressure processing chamber for a semiconductor wafer

Cleaning and liquid contact with solids – Apparatus – With spray or jet supplying and/or applying means

Reexamination Certificate

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Details

C134S902000, C156S345290, C118S715000, C118S733000

Reexamination Certificate

active

10680783

ABSTRACT:
A processing chamber having an improved sealing means is disclosed. The processing chamber comprises a lower element, an upper element, and a seal energizer. The seal energizer is configured to maintain the upper element against the lower element to maintain a processing volume. The seal energizer is further configured to generate a sealing pressure in a seal-energizing cavity that varies non-linearly with a processing pressure generated within the processing volume. In one embodiment, the seal energizer is configured to minimize a non-negative net force against one of the upper element and the lower element above a threshold value. The net force follows the equation P2*A2−P1*A1, where P2equals the sealing pressure, P1equals the processing pressure, A2equals a cross-sectional area of the seal-energizing cavity, and A1equals a cross-sectional area of the processing volume.

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