High-power RF device with heat spreader bushing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

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Details

257718, 257732, 165 803, 16510433, 174 525, 361707, 361714, 361760, H01L 2302, H01L 2312

Patent

active

052910636

ABSTRACT:
A high-power RF feedback resistor assembly includes a flat film resistor or other flat device mounted in thermal communication onto a bushing which is, in turn, mounted directly onto a cooling flange of an associated power transistor. A bushing has a vertical bolt hole through it to receive a threaded screw. The bushing can have a cutout beneath the flat vertical surface on which the resistor is mounted to provide clearance for a printed circuit board.

REFERENCES:
patent: 4517585 (1985-05-01), Ridout et al.
patent: 4990987 (1991-02-01), Boucher et al.

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