High power light emitting diode device

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S098000, C257S100000, C257S722000, C257S730000, C257SE51020, C257SE33075

Reexamination Certificate

active

07612386

ABSTRACT:
A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

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patent: 6011299 (2000-01-01), Brench
patent: 6501103 (2002-12-01), Jory et al.
patent: 6717494 (2004-04-01), Kikuchi et al.
patent: 6720651 (2004-04-01), Gaku
patent: 6828671 (2004-12-01), Aquien et al.
patent: 6864513 (2005-03-01), Lin et al.
patent: 7078803 (2006-07-01), Tilton et al.
patent: 2004/0136163 (2004-07-01), Horng et al.
patent: 2005/0073846 (2005-04-01), Takine
patent: 357155752 (1989-09-01), None

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