High power LED package and fabrication method thereof

Details High power LED package and fabrication method thereof High power LED package and fabrication method thereof

2011-01-25

2011-01-25

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S031000, C438S032000, C438S048000, C257S099000, C257S100000, C257S717000, C257SE33057, C257SE33066, C349S149000

Reexamination Certificate

active

07875476

ABSTRACT:
An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

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Japanese Office Action, with English translation, issued in Japanese Patent Application No. 2006-154790, mailed Feb. 23, 2010.

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