Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-12-01
1992-07-07
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156634, 156644, 156652, 156656, 1566591, 156901, 427 98, 428209, 428901, B44C 122, C23F 102, H05K 111, B32B 300
Patent
active
051279860
ABSTRACT:
The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive technique. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.
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August Melvin C.
Kruchowski James N.
Shepherd Lloyd T.
Cray Research Inc.
Powell William A.
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