Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2007-08-21
2007-08-21
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S041000, C216S049000, C216S052000, C216S067000, C216S100000, C216S105000, C216S106000, C219S121690, C205S125000, C029S847000
Reexamination Certificate
active
10459400
ABSTRACT:
A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the printed circuit board that includes an insulating layer of a high thermal conductivity, a semiconductor chip mounted within the through hole on the bottom surface of the heat spreader that includes a number of contact pads for bonding with the connection pads using gold wires, and a passive film filling the through hole and around the semiconductor chip. By interposing a ceramic insulating layer between the semiconductor chip and the heat spreader, charge generation between the semiconductor chip and the heat spreader is sharply reduced, and defects such as ESD (electrostatic discharge) is reduced during testing and mounting of the package.
REFERENCES:
patent: 4458291 (1984-07-01), Yanagisawa et al.
patent: 5055967 (1991-10-01), Sukonnik et al.
patent: 5909058 (1999-06-01), Yano et al.
patent: 6028489 (2000-02-01), Juang et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6197435 (2001-03-01), Tsujimura et al.
patent: 6377461 (2002-04-01), Ozmat et al.
patent: 6442043 (2002-08-01), Seki et al.
patent: 6562655 (2003-05-01), Glenn et al.
patent: 06-021610 (1994-01-01), None
patent: 09-199629 (1997-07-01), None
patent: 2001-0008549 (2001-02-01), None
English language abstract of Korean Publication No. 2001-0008549.
Cho Tae-Je
Kim Min-Ha
Kwon Heung-Kyu
Alanko Anita
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
LandOfFree
High-power ball grid array package, heat spreader used in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-power ball grid array package, heat spreader used in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-power ball grid array package, heat spreader used in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3888929