High performance interconnect system for an integrated circuit

Details High performance interconnect system for an integrated circuit High performance interconnect system for an integrated circuit

1990-11-08

1992-05-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 156651, 156653, 156656, 156657, 1566591, 357 67, 437190, 437192, 437195, 437199, H01L 2348, B44C 122, C03C 1500, C23F 102

Patent

active

051172763

ABSTRACT:
A semiconductor integrated circuit device includes a high performance interconnect structure which comprises a plurality of interconnects, with each interconnect being structurally separated from the remaining interconnects except at electrical contact points. In one embodiment, each interconnect is substantially surrounded by a layer of dielectric material, there being gaps between each adjacent layer of surrounding dielectric material. Another embodiment, a layer of electrically conductive material is formed over the surrounding dielectric layer preferably filling in the gaps between adjacent layers of surrounding dielectric material. The layer of electrically conductive material acts as a ground plane and heat sink.

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