Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2007-08-14
2007-08-14
Leo, Leonard R. (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C165S908000, C361S699000, C257S714000
Reexamination Certificate
active
10908758
ABSTRACT:
A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.
REFERENCES:
patent: 3909118 (1975-09-01), Schmidt
patent: 4302793 (1981-11-01), Rohner
patent: 4740866 (1988-04-01), Kajiwara et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 5265670 (1993-11-01), Zingher
patent: 5269372 (1993-12-01), Chu et al.
patent: 5309319 (1994-05-01), Messina
patent: 5388635 (1995-02-01), Gruber et al.
patent: 5731954 (1998-03-01), Cheon
patent: 6234240 (2001-05-01), Cheon
patent: 6459581 (2002-10-01), Newton et al.
patent: 6606251 (2003-08-01), Kenny, Jr. et al.
patent: 6650542 (2003-11-01), Chrysler et al.
patent: 6678168 (2004-01-01), Kenny, Jr. et al.
patent: 6688110 (2004-02-01), Dailey et al.
Berger Daniel G.
Bezama Raschid J.
Herron Lester W.
Michel Bruno
Natarajan Govindarajan
Blecker Ira D.
DeLio & Peterson LLC
International Business Machines - Corporation
Leo Leonard R.
Nowak Kelly M.
LandOfFree
High performance integrated MLC cooling device for high... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High performance integrated MLC cooling device for high..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High performance integrated MLC cooling device for high... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3837126