High performance flip chip package

Details High performance flip chip package High performance flip chip package

1998-08-05

2000-10-17

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257693, 257779, 22818022, H01L 2348, H01L 2352, H01L 2940

Patent

active

061336343

ABSTRACT:
An improved semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. A silicon die is attached to a carrier (or substrate) that has a cavity substantially surrounding the die. Direct connection of the active surface of the silicon die to the printed circuit board is then made by an array of solder bumps that is distributed across the surface of the die as well as the edges of the carrier surrounding the die.

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