High magnetic flux cathode apparatus and method for high product

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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Details

20429807, 20429809, 20429812, 20429819, C23C 1434

Patent

active

058765735

ABSTRACT:
A magnetron sputtering system is provided that uses cooling channels in the magnetron assembly to cool the target. The magnetron sputtering system also generates low pressure region in the magnetron assembly such that the backing plate sees a pressure differential much lower than atmospheric pressure. The backing plate is reduced in thickness and provides less of a barrier to the generated magnetic field.

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