High-insulation multi-layer device formed on a metal substrate

Details High-insulation multi-layer device formed on a metal substrate High-insulation multi-layer device formed on a metal substrate

1982-05-19

1983-12-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 156634, 156650, 156656, 156901, 174 685, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

044203640

ABSTRACT:
A high-insulation adhesive sheet is formed on a metal substrate. Bottom conductors are formed on the high-insulation adhesive sheet. A high-insulation organic layer is formed on the high-insulation adhesive sheet and the bottom conductors, and top conductors are formed thereon. The high-insulation organic layer is tightly attached to the metal substrate via the high-insulation adhesive sheet. The bottom conductors and the top conductors are communicated to each other via through holes formed in the high-voltage organic layer.

REFERENCES:
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3688396 (1972-09-01), Kilby et al.
patent: 3947957 (1976-04-01), Luttmer

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