High-frequency semiconductor device including microstrip transmi

Details High-frequency semiconductor device including microstrip transmi High-frequency semiconductor device including microstrip transmi

1993-04-30

1995-06-20

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Junction field effect transistor

257668, 257728, 333247, H01L 2302, H01L 2312, H01P 100

Patent

active

054263190

ABSTRACT:
A semiconductor device includes a silicon substrate on which a circuit having a predetermined function is formed and a high frequency circuit chip which is mounted on the silicon substrate and operates at high frequencies, and operates with functions of the silicon substrate and the high frequency circuit chip, wherein a thin film tape having a microstrip structure including an insulating film, a signal line on a surface of the insulating film and a grounding layer on a rear surface of the insulating film, is disposed on the silicon substrate, whereby the silicon substrate is electrically connected to the high frequency circuit chip. As a result, a conventional silicon substrate is employed and a production cost is reduced.

REFERENCES:
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 5049978 (1991-09-01), Bates et al.
patent: 5067005 (1991-11-01), Michii et al.
patent: 5087530 (1992-02-01), Wada et al.
Brandner et al, "Electrical Characterization of Polyhic, A High Density, High Frequency, Interconnection and Packaging Medium for Digital Circuits", IEEE, pp. 759-764.
Geller et al, "Integration And Packaging Of GaAs MMIC Subsystems Using Silicon Motherboards", IEEE GaAs IC Symposium, Technical Digest, Oct. 1990, pp. 85-87.

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