High frequency circuit chip and method of producing the same

Details High frequency circuit chip and method of producing the same High frequency circuit chip and method of producing the same

2005-01-04

2005-01-04

Nadav, Ori (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S669000, C438S670000, C257S728000, C216S013000

Reexamination Certificate

active

06838377

ABSTRACT:
In the production of a high frequency circuit chip in which a wiring pattern is disposed on a substrate having a through-hole, a connecting electrode of the through-hole is formed by filling electrically conductive paste into a perforation and firing it, and the wiring pattern is formed by a lift-off method. Moreover, at least the surface of the substrate for the wiring pattern to be formed thereon is mirror-polished, and thereafter, the wiring pattern is formed on the mirror-polished surface by the lift-off method.

REFERENCES:
patent: 4665468 (1987-05-01), Dohya
patent: 5190892 (1993-03-01), Sano
patent: 5480048 (1996-01-01), Kitamura et al.
patent: 61091998 (1986-05-01), None

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